BGA brittle fracture - alternative solder joint integrity test methods
- 28 July 2005
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 2, 1194-1201
- https://doi.org/10.1109/ectc.2005.1441422
Abstract
No abstract availableThis publication has 11 references indexed in Scilit:
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