Analysis of solder joint fracture under mechanical bending test
- 22 June 2004
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1731-1737
- https://doi.org/10.1109/ectc.2003.1216536
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Effect of strain rate on solder joint failure under mechanical loadPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- A TEM Observation of Solder Joints of an Electronic DeviceJournal of the Japan Institute of Metals and Materials, 2000