Missing solder ball failure mechanisms in plastic ball grid array packages

Publisher Website

7 November 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/ectc.2000.853139

Abstract

No abstract available

Keywords

This publication has 6 references indexed in Scilit:

Solder metallization interdiffusion in microelectronic interconnects
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003
Assembly process and solder joint integrity of the metal ball grid array (MBGA/sup TM/) package
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
The improvement of PBGA solder ball strength under high temperature storage
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
An expanded Cu-Ni-Sn system (Copper-Nickel-Tin)
Journal of Phase Equilibria and Diffusion, 2000
Solder joint reliability of plastic ball grid array packages
Soldering & Surface Mount Technology, 1999
Materials interaction in PbSn/NiP/Al and PbSn/NiB/Al solder bumps on chips
Thin Solid Films, 1993