A temperature-aware simulation environment for reliable ULSI chip design

journal article
Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Vol. 19 (10) , 1211-1220
https://doi.org/10.1109/43.875333

Abstract

In this paper, we present a temperature-aware simulation environment, iTAS, which has been developed for the design of thermally reliable ultra-large scale integrated (ULSI) chips. This environment provides advisory information from the early chip design phase to the post-layout analysis phase. Several important applications, including temperature-sensitive timing analysis, efficient on-chip hot-spot identification, and thermally reliable package design are addressed, iTAS can be used not only for reliability checking, but also for better thermal engineering to enhance the overall chip performance

Keywords

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