About the origin and the mechanisms involved in the cracking of highly porous silicon layers under capillary stresses
- 1 April 1996
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 276 (1-2) , 219-222
- https://doi.org/10.1016/0040-6090(95)08057-0
Abstract
No abstract availableKeywords
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