DIFFUSION ANOMALIES IN THIN METALLIC FILMS
- 1 May 1969
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 14 (9) , 283-285
- https://doi.org/10.1063/1.1652816
Abstract
The absence of void formation at the interface of aluminum‐gold thin‐film diffusion couples after diffusion annealing is noted in studies reported here. This is in contrast to the void formation observed in bulk aluminum‐gold couples. The Kirkendall‐effect explanation is believed not applicable to these thin‐film samples where it is proposed that the rapid surface diffusion replenishes the formed vacancies, thus preventing vacancy condensation and void formation.Keywords
This publication has 3 references indexed in Scilit:
- Diffusion in evaporated films of gold-aluminiumPhilosophical Magazine, 1962
- On the porosity observed in the Kirkendall effectActa Metallurgica, 1953
- Heat Generation by Electric Sparks and Rate of Heat Loss to the Spark ElectrodesThe Journal of Chemical Physics, 1951