Feasibility of Some Lead‐free Solder Alloys as Filler Materials for Z‐axis Adhesives
- 1 February 1995
- journal article
- Published by Emerald Publishing in Soldering & Surface Mount Technology
- Vol. 7 (2) , 10-12
- https://doi.org/10.1108/eb037892
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- A Solder Alloy Filled Z-Axis Conductive Epoxy AdhesiveThe Journal of Adhesion, 1995
- Progress in the design of new lead-free solder alloysJOM, 1993
- Issues in the replacement of lead-bearing soldersJOM, 1993