A Solder Alloy Filled Z-Axis Conductive Epoxy Adhesive

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Abstract
Epoxy adhesives filled with four different volume fractions of eutectic tin-bismuth solder alloy were prepared and the effect of filler content on the electrical and mechanical properties of these anisotropic electrically conductive adhesives was investigated. The results show that the adhesive containing the lowest amount of the filler alloy had the best combination of conductivity, insulation resistance and shear strength. The DSC-measurements suggested that the filler melts before the cure of the resin begins which allows the filler to wet and bond well to the conductors. This was verified by SEM/EPMA examinations. A temperature cycling test and high humidity, high temperature treatment were conducted on the best composite adhesive. The temperature variation had no effect on conductivity of the joints while humid and hot environment decreased the conductivity.