Adhesion of Polyethylene to Copper: Importance of Substrate Topography

Publisher Website
Google Scholar
Abstract
In order to get good adhesion between polyethylene and copper previous workers have oxidized the metal in alkaline solution to give a matt black oxide film. In this paper it is shown that the good adhesion obtained is associated with the very rough, fibrous nature of the matt black oxide film. Adhesion rises as the layer develops on the copper. If the fibres are damaged to alter the topography without changing the chemical nature of the substrate, the adhesion falls markedly. If the chemical nature of the oxide film is changed by electrolytic reduction, with minimum change in topography, the adhesion is still substantial. Adhesion to these matt black oxide films is still good if oxidation of the polymer is suppressed either by incorporation of stabilizers or by coating in a nitrogen atmosphere. This further points to the importance of topography in adhesion to these surfaces.