Model and analyses for solder reflow cracking phenomenon in SMT plastic packages
- 30 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
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- Analytical and experimental study for designing molding compounds for surface mounting devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Special properties of molding compound for surface mounting devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Moisture Resistance Degradation of Plastic LSIs by Reflow SolderingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1985