Residual Stresses in Meta/Ceramic Bonded Strips
- 1 May 1985
- journal article
- Published by Wiley in Journal of the American Ceramic Society
- Vol. 68 (5) , 241-248
- https://doi.org/10.1111/j.1151-2916.1985.tb15316.x
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
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- Microelectronic PackagingScientific American, 1983
- Mechanical Properties of Liquid‐Phase‐Bonded Copper‐Ceramic SubstratesJournal of the American Ceramic Society, 1982
- A new hybrid power technique utilizing a direct Copper to ceramic bondIEEE Transactions on Electron Devices, 1976
- Thermal Stresses in a Rectangular Plate Clamped Along an EdgeJournal of Applied Mechanics, 1949