Study of the copper reflow process using the GROFILMS simulator
- 1 September 1997
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
- Vol. 15 (5) , 1780-1787
- https://doi.org/10.1116/1.589525
Abstract
No abstract availableThis publication has 8 references indexed in Scilit:
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