Bulk electromigration reliability tests of large-grained aluminum lines with regard to semiconductor contacts
- 26 September 1986
- journal article
- Published by Elsevier in Solid-State Electronics
- Vol. 29 (9) , 893-901
- https://doi.org/10.1016/0038-1101(86)90010-9
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
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