Relation between surface structures and sputtering ratios of copper single crystals

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Abstract
Polished (100) Cu crystals have been bombarded at target temperatures of 204 K, 294 K and 456 K by 10 and 20 keV Ne+ ions up to a total dose of 1.7 × 1019 ions/cm2. The plane of incidence was chosen to be a {100} plane perpendicular to the surface. Measurements have been performed for incident angles between 36° and 44° with respect to the surface normal. In this angular interval the sputtering ratio and the surface structure have been studied by weightloss and replica electron microscope techniques respectively. At target temperatures of 204 K and 294 K an anomaly was observed in the curve of the sputtering ratio versus angle of incidence. A small peak appears where the curve slopes towards the 〈110〉 minimum. The position and height of the peak is a function of target temperature and ion energy. This sputtering submaximum is accompanied by the formation of {100} orientated furrows perpendicular to the ion beam. The nucleation of this relief is tentatively discussed in terms of local deviations from perfection of the surface, which might be due to a singularity in the production of focusing collisions influencing the damage structure. The growth of the furrows and the submaximum in the sputtering ratio are discussed in terms of the angle between the ion beam and the characteristic {110} side of the furrows. These sputtering and faceting phenomena have not been observed at 20 keV Ar+ ion bombardment nor generally under bombardment at a target temperature of 456 K.