Correlation of analytical and experimental approaches to determine thermally induced PWB warpage
- 1 January 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 16 (8) , 986-995
- https://doi.org/10.1109/33.273701
Abstract
Thermomechanical design effects in the printed wiring board (PWB) design process are considered, In particular, a research project for developing advanced finite-element method (FEM)-oriented capabilities to simulate thermally induced PWB warpage is reported. The FE analysis results are validated by correlating them with measurements obtained from a separate experimental approach using the shadow Moire methodKeywords
This publication has 2 references indexed in Scilit:
- Analytical Modeling in Electronic Packaging Structures: Its Merits, Shortcomings and Interaction With Experimental and Numerical TechniquesJournal of Electronic Packaging, 1989
- A shadow moire technique for the measurement of damage in compositesComposite Structures, 1985