The effect of reflow process variables on the wettability of lead-free solders
- 1 July 1993
- journal article
- Published by Springer Nature in JOM
- Vol. 45 (7) , 33-35
- https://doi.org/10.1007/bf03222378
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- The Use of Bismuth Alloy Systems for Reflow and Wave SolderingSoldering & Surface Mount Technology, 1992