Solder Post Attachment of Ceramic Chip Carriers to Ceramic Film Integrated Circuits

This publication has 6 references indexed in Scilit:

• Recent advances in solder bond technology for microelectronic packaging
  Thin Solid Films, 1980
• Temperature Aging of External Connections Condensation Soldered to Ti-Pd-Au Thin Films
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979
• The reliability of semiconductor devices in the bell system
  Proceedings of the IEEE, 1974
• Modifications of a non-linear regression technique used to calculate surface tension from sessile drops
  Surface Science, 1971
• Geometric Optimization of Controlled Collapse Interconnections
  IBM Journal of Research and Development, 1969
• BOUNDARY TENSION BY PENDANT DROPS¹
  The Journal of Physical Chemistry, 1938