Temperature Aging of External Connections Condensation Soldered to Ti-Pd-Au Thin Films
- 1 June 1979
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 2 (2) , 180-195
- https://doi.org/10.1109/tchmt.1979.1135443
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Corrosion of solder-coated TiPdAu thin film conductors in a moist chlorine atmosphereThin Solid Films, 1977
- The Effect of Thin Film Deposition Angle andSubstrate Surface Roughness on Film Dissolution in Molten 60% Sn–40% Pb SolderActive and Passive Electronic Components, 1977
- Solders, Solderable Finishes and Reflowed Solder CoatingsCircuit World, 1977
- Diffusion mechanisms in the Pd/Au thin film system and the correlation of resistivity changes with Auger electron spectroscopy and Rutherford backscattering profilesThin Solid Films, 1976
- The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead AlloysTransactions of the IMF, 1976
- Interdiffusion and reaction in bimetallic Cu-Sn thin filmsActa Metallurgica, 1973