Growth Of Polyimide Films By Chemical Vapor Deposition And Their Characterization

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Abstract
A dry ultra high vacuum technique for the preparation of polyimide films is investigated as an alternative to standard wet processing techniques involving the use of solvents. This technique is based on the co-deposition of monomers (pyromellitic dianhydride and oxydianaline in this study) to form polyimide (poly (4,4′-oxydiphenylenepyromellitimide)). Various parameters to optimize film growth are investigated and the properties of the films are compared to films prepared by spin casting from solution. Films from 10Å to 15 μ were grown. Uniform films over 3 inch wafers were successfully grown. Many properties such as adhesion, dielectric constant and stress were similar to spun films. H-lowever, these films did exhibit more crystalinity but less orientation than the spun films. Finally, being a vapor phase process the rdms were conformal rather than planar.

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