Vertical resonant couplers with precise coupling efficiency control fabricated by wafer bonding
- 1 August 1999
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Photonics Technology Letters
- Vol. 11 (8) , 1003-1005
- https://doi.org/10.1109/68.775327
Abstract
A fabrication technique to create complex three-dimensional waveguide devices is effected by using wafer bonding to process two sides of an epitaxial structure. Vertical resonant couplers with precise control over coupling efficiency are demonstrated.Keywords
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