Investigation of interfacial reactions in thin film couples of aluminum and copper by measurement of low temperature contact resistance
- 1 February 1980
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 65 (3) , 381-391
- https://doi.org/10.1016/0040-6090(80)90248-5
Abstract
No abstract availableKeywords
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