Electromigration Study of Ai/Low K Dielectric Line Structures
- 1 January 1998
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Integration Of BPDA-PDA Polyimide With Two Levels Of Al(Cu) InterconnectsMRS Proceedings, 1995
- Process Integration Of Low-Dielectric-Constant MaterialsMRS Proceedings, 1995
- Microtexture determination by electron back-scatter diffractionJournal of Materials Science, 1992