Rapid thermal curing of BCB dielectric
- 2 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- Benzocyclobutene as a dielectric for multichip module fabricationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Real-Time FT-IR Studies Of The Reaction Kinetics For The Polymerization Of Divinyl Siloxane Bis-Benzocyclobutene MonomersMRS Proceedings, 1991
- Mechanical Behavior of Benzocyclobutene Films on Silicon SubstratesMRS Proceedings, 1991
- Benzocyclobutene (BCB) dielectrics for the fabrication of high density, thin film multichip modulesJournal of Electronic Materials, 1990
- Benzocyclobutene interlayer dielectrics for thin film multichip modulesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990
- Moisture Uptake of Bisbenzocyclobutene (BCB) Films for Electronic Packaging ApplicationsMRS Proceedings, 1990
- Fabrication of high density multichip modulesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990
- Photosensitive PolyimidesMRS Proceedings, 1989
- Development of Polyimide Isoindoloquinazolinedione in Multilevel Interconnections for Large-Scale Integration (LSI)Published by American Chemical Society (ACS) ,1982
- Transmission Spectra without Interference FringesApplied Spectroscopy, 1977