Mechanical Behavior of Benzocyclobutene Films on Silicon Substrates
- 1 January 1991
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
The evolution of the stress in coatings derived from divinylsiloxane bisbenzocyclobutene, mixed stereo and positional isomers of 1,3-bis(2-bicyclo[4.2.0]octa-1,3,5-trien-3-ylethenyl)-1,1,3,3-tetramethyl disiloxane (CAS 117732-87-3), has been measured on silicon substrates with an optically levered beam during thermal cycles. The stress at room temperature in gelled coatings varies between ca. 15 MPa and 45 MPa depending on the cure schedule. The progression of the polymer's glass transition temperature is correlated with the evolution of the structural state observed with FTIR. A method is presented for predictably controlling substrate curvature during multilayer processing.Keywords
This publication has 6 references indexed in Scilit:
- The Processing and Properties of Multilayer Interconnection Structures Using Thermoset Films Derived from Bisbenzocyclobutene.MRS Proceedings, 1989
- Film Stress in High Density Thin Film InterconnectMRS Proceedings, 1989
- Principles and Applications of Wafer Curvature Techniques for Stress Measurements in Thin FilmsMRS Proceedings, 1988
- Elastic relationships in layered composite media with approximation for the case of thin films on a thick substrateJournal of Applied Physics, 1987
- Thermal stresses and cracking resistance of dielectric films (SiN, Si3N4, and SiO2) on Si substratesJournal of Applied Physics, 1978
- Calculated elastic constants for stress problems associated with semiconductor devicesJournal of Applied Physics, 1973