Electrochemically deposited thin film alloys for ULSI and MEMS applications
- 31 January 2000
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 50 (1-4) , 525-531
- https://doi.org/10.1016/s0167-9317(99)00323-8
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Damascene copper electroplating for chip interconnectionsIBM Journal of Research and Development, 1998
- High aspect ratio quarter-micron electroless copper integrated technologyMicroelectronic Engineering, 1997
- Copper electroless deposition technology for ultra-large-scale-integration (ULSI) metallizationMicroelectronic Engineering, 1997
- Electroless copper deposition for ULSIThin Solid Films, 1995