Interfacial reactions between Ni substrate and the component Bi in solders
- 1 January 1999
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 28 (1) , 57-62
- https://doi.org/10.1007/s11664-999-0195-7
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- Microstructures developed in solid-liquid reactions: using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examplesMaterials Science and Engineering: A, 1997
- Lead‐free Tin Surface Finish for PCB AssemblyCircuit World, 1997
- Growth kinetics of compound layers at the nickel-bismuth interfaceJournal of Alloys and Compounds, 1996
- Determination of NiBi3 reaction-diffusion constants in Ni-Bi couplesJournal of Materials Science Letters, 1995
- Metallurgy of low temperature Pb-free solders for electronic assemblyInternational Materials Reviews, 1995
- Reactive diffusion in a prototype system: nickel-aluminum I: Non-constant diffusion coefficientThin Solid Films, 1992
- Equilibres de phases dans le systeme binaire nickel-bismuthJournal of the Less Common Metals, 1988
- Nucleation of a new phase from the interaction of two adjacent phases: Some silicidesJournal of Materials Research, 1988
- The Bi−Ni (Bismuth-Nickel) systemBulletin of Alloy Phase Diagrams, 1985
- Some aspects of the growth of diffusion layers in binary systemsJournal of Nuclear Materials, 1961