Evaluation of Lead- Free Solder Joints in Electronic Assemblies
- 1 August 1994
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 23 (8) , 757-764
- https://doi.org/10.1007/bf02651370
Abstract
No abstract availableKeywords
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- Effect of compositional changes and impurities on wetting properties of eutectic Sn–Bi alloy used as solderMaterials Science and Technology, 1985
- Immersion Wave Soldering ProcessIBM Journal of Research and Development, 1982