Characterization of eutectic Sn-Bi solder joints
- 1 June 1992
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 21 (6) , 599-607
- https://doi.org/10.1007/bf02655427
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- Effects of cooling rate on mechanical properties of near-eutectic tin-lead solder jointsJournal of Electronic Materials, 1991
- Superplastic Creep of Eutectic Tin-Lead Solder JointsJournal of Electronic Packaging, 1991
- Superplastic creep of eutectic tinlead solder jointsJournal of Electronic Materials, 1990
- Solder Paste in Electronics PackagingPublished by Springer Nature ,1989
- Low Temperature SolderingCircuit World, 1984
- Job Restructuring and Work OrganisationManagement Decision, 1974
- Interstitial Diffusion of Copper in TinJournal of Applied Physics, 1967
- Diffusion of Gold and Silver in Tin Single CrystalsJournal of Applied Physics, 1966
- Interstitial Diffusion of Copper and Silver in LeadJournal of Applied Physics, 1966