Superplastic creep of eutectic tinlead solder joints
- 1 November 1990
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 19 (11) , 1273-1280
- https://doi.org/10.1007/bf02673342
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- Creep and Stress Relaxation in Solder Joints of Surface-Mounted Chip CarriersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Superplastic behavior of the Sn-Pb eutectic in the as-worked stateMetallurgical Transactions A, 1982
- Experimental constitutive relations for the high temperature deformation of a PbSn eutectic alloyMaterials Science and Engineering, 1981
- Superplastic behavior of PbSn eutectic alloyMaterials Science and Engineering, 1979
- Deformation of PbSn eutectic alloys at relatively high strain ratesActa Metallurgica, 1979
- Superplastic deformation of the Pb-Sn eutecticJournal of Materials Science, 1976
- Creep behaviour in the superplastic Pb–62% Sn eutecticPhilosophical Magazine, 1975
- Stress relaxation in superplastic materialsJournal of Materials Science, 1973
- Constant stress creep and constant true strain-rate tensile tests of the superplastic alloy PbSnJournal of Materials Science, 1972
- A theory for flow of polycrystalsActa Metallurgica, 1967