Creep and Stress Relaxation in Solder Joints of Surface-Mounted Chip Carriers
- 1 December 1987
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 10 (4) , 556-565
- https://doi.org/10.1109/tchmt.1987.1134800
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
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