The Influence of Temperature on Stress Relaxation in a Chill-Cast, Tin-Lead Solder
- 1 December 1973
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 9 (4) , 243-246
- https://doi.org/10.1109/tphp.1973.1136734
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Some Effects of Temperature on Material Properties and Device ReliabilityIEEE Transactions on Parts, Hybrids, and Packaging, 1972
- Stress Relaxation and Fatigue of Two Electromechanical Spring Materials Strengthened by Thermomechanical ProcessingIEEE Transactions on Parts, Materials and Packaging, 1971
- Kinetics of Stress Relaxation in MetalsTransactions of the Society of Rheology, 1966
- A GENERALIZED THEORY OF PLASTICITY INVOLVING THE VIRIAL THEOREMProceedings of the National Academy of Sciences, 1955