A new anisotropic conductive film with arrayed conductive particles
- 1 January 1996
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 19 (4) , 752-757
- https://doi.org/10.1109/96.544366
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Direct chip interconnect with adhesive-connector filmsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- An overview and evaluation of anisotropically conductive adhesive films for fine pitch electronic assemblyIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1993
- Anisotropically conductive polymer films with a uniform dispersion of particlesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1993