Deformation Mechanisms in Thin Films
- 24 October 1992
- journal article
- Published by Springer Nature in MRS Proceedings
- Vol. 265 (1) , 3-14
- https://doi.org/10.1557/proc-265-3
Abstract
No abstract availableKeywords
This publication has 35 references indexed in Scilit:
- A study of stress-driven diffusive growth of voids in encapsulated interconnect linesJournal of Materials Research, 1992
- Measurement and interpretation of stress in copper films as a function of thermal historyJournal of Materials Research, 1991
- Mechanisms of thermal stress relaxation and stress-induced voiding in narrow aluminum-based metallizationsJournal of Applied Physics, 1991
- A model for the effect of line width and mechanical strength on electromigration failure of interconnects with “near-bamboo” grain structuresJournal of Materials Research, 1991
- Mechanical Properties of Thin FilmsAnnual Review of Materials Science, 1990
- Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin filmsJournal of Materials Research, 1988
- Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniquesJournal of Materials Research, 1986
- Hall-petch relation in thin film metallizationsScripta Metallurgica, 1986
- Stress relaxation in thin aluminium filmsThin Solid Films, 1985
- Grain-boundary sliding and diffusion creep in polycrystalline solidsPhilosophical Magazine, 1971