Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting, and Vibration Conditions
- 1 April 1996
- journal article
- research article
- Published by Emerald Publishing in Circuit World
- Vol. 22 (1) , 27-32
- https://doi.org/10.1108/03056129610799912
Abstract
The mechanical and vibration responses of 225‐pin, 324‐pin and 396‐pin PBGA (plastic ball grid array) solder joints have been determined in this study. The effects of overload environmental stress factors on the mechanical responses of the solder joints have been determined by bending and twisting experiments. The effects of shipping and functional environmental stress factors on the vibration responses of the solder joints have been determined by out‐of‐plane vibration experiments and a mathematical analysis.Keywords
This publication has 3 references indexed in Scilit:
- Linear finite element stress simulation of solder joints on 225 I/O plastic BGA package under thermal cyclingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibrational conditionsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996
- No Clean Mass Reflow of Large Plastic Ball Grid Array PackagesCircuit World, 1994