Interconnections in VLSI
- 1 October 1986
- journal article
- Published by AIP Publishing in Physics Today
- Vol. 39 (10) , 58-66
- https://doi.org/10.1063/1.881069
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Layered and Homogeneous Films of Aluminum and Aluminum/Silicon with Titanium and Tungsten for Multilevel InterconnectsIEEE Journal of Solid-State Circuits, 1985
- Reliability Evaluation of Aluminum-Metallized MOS Dynamic RAM's in Plastic Packages in High Humidity and Temperature EnvironmentsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981
- A 1-µm bipolar VLSI technologyIEEE Transactions on Electron Devices, 1980
- Metallization in microelectronicsThin Solid Films, 1977
- Electromigration in thin aluminum films on titanium nitrideJournal of Applied Physics, 1976