Reliability Evaluation of Aluminum-Metallized MOS Dynamic RAM's in Plastic Packages in High Humidity and Temperature Environments
- 1 December 1981
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 4 (4) , 476-481
- https://doi.org/10.1109/tchmt.1981.1135819
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
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- Temperature-Humidity Acceleration of Metal-Electrolysis Failure in Semiconductor Devices8th Reliability Physics Symposium, 1973
- The I.C. Plastic Package a Simple Method for Predicting Package Performance8th Reliability Physics Symposium, 1972
- Environmental Factors Governing Field Reliability of Plastic Transistors and Integrated Circuits8th Reliability Physics Symposium, 1972
- Acceleration Factors for Environmental Life Testing of Integrated CircuitsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1971
- A laboratory study of the atmospheric corrosion of metals. Part I.—The Corrosion of copper in certain synthetic atmospheres, with particular reference to the influence of sulphur dioxide in air of various relative humiditiesTransactions of the Faraday Society, 1931