The influence of some evaporation parameters on the structure and properties of thin aluminium films
- 1 November 1982
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 97 (3) , 259-276
- https://doi.org/10.1016/0040-6090(82)90460-6
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Effects of argon pressure and substrate temperature on the structure and properties of sputtered copper filmsJournal of Vacuum Science and Technology, 1981
- Purity and morphology of aluminium filmsThin Solid Films, 1975
- Influence of substrate temperature and deposition rate on structure of thick sputtered Cu coatingsJournal of Vacuum Science and Technology, 1975
- Superior Aluminum for Interconnections of Integrated CircuitsApplied Physics Letters, 1971
- An electron-bombardment evaporation source for nickel-iron alloysJournal of Scientific Instruments, 1964