Laser-annealing behavior of a phosphorus-implanted silicon substrate covered with a SiO2 film

Abstract
Laser‐annealing behavior of phosphorus‐implanted silicon substrates is investigated as a function of the SiO2 film thickness formed on implanted surfaces. Surface‐carrier concentration after laser irradiation through the SiO2 layers shows periodic enhancement in relation to SiO2 thickness. Calculation of laser energy transferred into the silicon surface through various SiO2 film thicknesses is carried out and the results agree well with the experiments.

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