New technique and analysis of accelerated electromigration life testing in multilevel metallizations
- 10 October 1988
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 53 (15) , 1414-1416
- https://doi.org/10.1063/1.99958
Abstract
Electromigration failure of a series-parallel configuration of aluminum interconnects overlayed on tungsten contacts was measured using a novel multiple lognormal analysis. The analysis examined early failure mechanisms and allowed rapid determination of electromigration parameters on a statistically large number of junctions. The primary failure mode of these stuctures was complete migration of Al off of the W pads. This work suggested that Al/W metallizations, with a large number of series contacts, are prone to short mean time to failures.Keywords
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