Abstract
The performances of thin-film SOI (silicon-on-insulator) MOSFETs and CMOS circuits are presented. Attention is given to the SOI material, device properties, and design and processing. It is noted that this technology is extremely attractive for deep-submicron applications because of such properties as improved subthreshold slope, reduced short-channel effects, reduced electric fields, increased transconductance, and better immunity to soft errors. Front-end CMOS processing of thin films of SOI is also considerably simpler than bulk device processing. The competitiveness of TFSOI technology on the CMOS market is discussed.<>