Novel fast cure and reworkable underfill materials
- 20 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Experimental and analytical study on the flow of encapsulant during underfill encapsulation of flip-chipsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Underfill of flip chip on laminates: simulation and validationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002