Residual stress and strain distribution anomalies in TiN films deposited by physical vapor deposition
- 31 October 1990
- journal article
- Published by Elsevier in Surface and Coatings Technology
- Vol. 42 (1) , 49-68
- https://doi.org/10.1016/0257-8972(90)90114-r
Abstract
No abstract availableThis publication has 46 references indexed in Scilit:
- Microstructure modification of TiN by ion bombardment during reactive sputter depositionPublished by Elsevier ,2002
- Plastic flow in ion‐assisted deposition of refractory metalsJournal of Vacuum Science & Technology A, 1988
- Variations in the reflectance of TiN, ZrN and HfNThin Solid Films, 1988
- Method for complex X-ray diffraction analysis of TiN coatingsCrystal Research and Technology, 1987
- The microstructure of sputter‐deposited coatingsJournal of Vacuum Science & Technology A, 1986
- Book Review: Preparation and properties of thin filmsJournal of Vacuum Science & Technology A, 1983
- High Rate Thick Film GrowthAnnual Review of Materials Science, 1977
- Internal stresses in titanium, nickel, molybdenum, and tantalum films deposited by cylindrical magnetron sputteringJournal of Vacuum Science and Technology, 1977
- On the determination of lattice parameters by the debye-scherrer methodProceedings of the Physical Society, 1945
- The influence of absorption on the shapes and positions of lines in debye-scherrer powder photographsProceedings of the Physical Society, 1945