FirstLight: Pluggable Optical Interconnect Technologies for Polymeric Electro-Optical Printed Circuit Boards in Data Centers
Open Access
- 22 August 2012
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Lightwave Technology
- Vol. 30 (21) , 3316-3329
- https://doi.org/10.1109/jlt.2012.2214764
Abstract
The protocol data rate governing data storage devices will increase to over 12 Gb/s by 2013 thereby imposing unmanageable cost and performance burdens on future digital data storage systems. The resulting performance bottleneck can be substantially reduced by conveying high-speed data optically instead of electronically. A novel active pluggable 82.5 Gb/s aggregate bit rate optical connector technology, the design and fabrication of a compact electro-optical printed circuit board to meet exacting specifications, and a method for low cost, high precision, passive optical assembly are presented. A demonstration platform was constructed to assess the viability of embedded electro-optical midplane technology in such systems including the first ever demonstration of a pluggable active optical waveguide printed circuit board connector. High-speed optical data transfer at 10.3125 Gb/s was demonstrated through a complex polymer waveguide interconnect layer embedded into a 262 mm × 240 mm × 4.3 mm electro-optical midplane. Bit error rates of less than 10-12 and optical losses as low as 6 dB were demonstrated through nine multimode polymer wave guides with an aggregate data bandwidth of 92.8125 Gb/s.Keywords
This publication has 21 references indexed in Scilit:
- High-speed backplane connectorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2011
- Wideband Low-Reflection Transmission Lines for Bare Chip on Multilayer PCBETRI Journal, 2011
- Passive assembly of parallel optical devices onto polymer‐based optical printed circuit boardsCircuit World, 2010
- SUPPRESSION OF CROSSTALK USING SERPENTINE GUARD TRACE VIASProgress In Electromagnetics Research, 2010
- Gigahertz-Range Analysis of Impedance Profile and Cavity Resonances in Multilayered PCBsIEEE Transactions on Electromagnetic Compatibility, 2009
- 160 Gb/s Bidirectional Polymer-Waveguide Board-Level Optical Interconnects Using CMOS-Based TransceiversIEEE Transactions on Advanced Packaging, 2009
- Embedding capacitors and resistors into printed circuit boards using a sequential lamination techniqueJournal of Materials Processing Technology, 2008
- Integrated optical and electronic interconnect printed circuit board manufacturingCircuit World, 2008
- Terabus: Terabit/Second-Class Card-Level Optical Interconnect TechnologiesIEEE Journal of Selected Topics in Quantum Electronics, 2006
- An Accurate Transient Analysis of High-Speed Package Interconnects Using Convolution TechniqueAnalog Integrated Circuits and Signal Processing, 2003