Alternative Finishes to Gold in the Printed Circuit Industry
- 1 January 1977
- journal article
- research article
- Published by Taylor & Francis in Transactions of the IMF
- Vol. 55 (1) , 94-96
- https://doi.org/10.1080/00202967.1977.11870424
Abstract
Silver, platinum group metals and gold alloy deposits are compared with hard gold deposits for use on circuit board connectors. Safety factors and electrolyte compatibility with resists are discussed along with comparative costs.Keywords
This publication has 4 references indexed in Scilit:
- Alloy Gold Deposits: Have They Any Industrial Use?Transactions of the IMF, 1974
- Electrodeposition of Ductile PalladiumTransactions of the IMF, 1968
- Physical Properties of Palladium ElectrodepositsTransactions of the IMF, 1966
- Palladium Plating of Printed CircuitsPlatinum Metals Review, 1960