Through-thickness characterization of copper electrodeposit

This publication has 18 references indexed in Scilit:

• The Role of Texture On The Reliability Of Aluminum Based Interconnects
  MRS Proceedings, 1993
• X-Ray Diffraction Method for Monitoring of Texture Evolution in Layers
  Materials Science Forum, 1993
• Microstructure and Mechanical Properties of Electroless Copper Deposits
  Annual Review of Materials Science, 1991
• Texture Development in Thin Metallic Films
  Texture, Stress, and Microstructure, 1991
• A structural study of a metastable BCC phase in AlMn alloys electrodeposited from molten salts
  Scripta Metallurgica, 1989
• TEM Observation of Microstructure in Sputtered Co-Cr Film
  Japanese Journal of Applied Physics, 1985
• Nature unmirrored, epistemology naturalized
  Synthese, 1983
• The microstructure and magnetic properties of electroplated cobalt film for perpendicular magnetic recording
  IEEE Transactions on Magnetics, 1982
• Electrocrystallization of nickel coatings with 〈211〉 texture
  Surface Technology, 1981
• MECHANICAL PROPERTIES OF METALLIC FILMS
  Soviet Physics Uspekhi, 1969