Monitoring the cure of a composite matrix resin with microdielectrometry

This publication has 7 references indexed in Scilit:

• Measurement and Application of Dielectric Properties
  IEEE Electrical Insulation Magazine, 1986
• The use of microdielectrometry in monitoring the cure of resins and composites
  Polymer Engineering & Science, 1986
• Monitoring of laminate cure with microdielectrometry
  Polymer Engineering & Science, 1986
• Dielectric analysis of thermoset cure
  Published by Springer Nature ,1986
• The Role of Boundary Layer Capacitance at Blocking Electrodes in the Interpretation of Dielectric Cure Data in Adhesives
  The Journal of Adhesion, 1985
• The Temperature Dependence of Relaxation Mechanisms in Amorphous Polymers and Other Glass-forming Liquids
  Journal of the American Chemical Society, 1955
• The Electrical, Chemical and Physical Properties of Alkyd Resins
  Transactions of The Electrochemical Society, 1934