Packaging for thermal management of power electronics building blocks using metal posts interconnected parallel plate structure
- 27 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Extraction of parasitics within wire-bond IGBT modulesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- High frequency, low cost, power packaging using thin film power overlay technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1995