Extraction of parasitics within wire-bond IGBT modules
- 27 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 497-503
- https://doi.org/10.1109/apec.1998.647735
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Pressure contact assembly technology of high power devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Power cycling reliability of IGBT power modulesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002