Die bond materials and bonding mechanisms in microelectronic packaging
- 1 October 1987
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 153 (1-3) , 431-445
- https://doi.org/10.1016/0040-6090(87)90203-3
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Trends in packaging and interconnection of integrated circuitsMicroelectronics Journal, 1981
- Phase Relations in the System Boron Oxide–SilicaJournal of the American Ceramic Society, 1965