Trends in packaging and interconnection of integrated circuits
- 28 February 1981
- journal article
- Published by Elsevier in Microelectronics Journal
- Vol. 12 (1) , 23-29
- https://doi.org/10.1016/s0026-2692(81)80307-2
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- IBM Multichip Multilayer Ceramic Modules for LSI Chips-Design for Performance and DensityIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1980
- Bumped Tape Automated Bonding (BTAB) Practical Application GuidelinesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979
- Chip Carriers as a Means for High-Density PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1978
- Advances in deposition processes for passivation filmsJournal of Vacuum Science and Technology, 1977
- Control of the encapsulation material as an aid to long term reliability in plastic encapsulated semiconductor components (PEDs)Microelectronics Reliability, 1977